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●Development of materials
Development of high-grade, low-cost materials by special induction heating dissolution and casting process
Functionality: Material having properties of electrical conductivity, heat conductivity, and adhesiveness
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●Shape
Powder, paste, wire, rod, sheet, and other forms
●Relative proportions
Products are available in various relative proportions upon request. |
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Material for device chip bonding |
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Metal thin wire
(Various wire sizes are available upon request.) |
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Metal ultra-thin wire
(For bumping, bonding wire) |
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Material for package sealing |
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For crystal device and high-frequency device
Au-Sn, Au-Ge, other Au alloys
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Low-cost sealing materials are under development as alternative material for Au alloy. |
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Material for device chip bonding |
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High-temperature type lead-free soldering alloy
Sn-Ag alloy (Special improvement additive
element: Cu, Zn, In, Bi, Ni, Ge)High-temperature
type lead-free soldering alloy |
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Mid-temperature type lead-free soldering alloy
Sn-Zn alloy (Special improvement additive element: Bi, Cu, In, Ni) |
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Low-temperature type lead-free soldering alloy
Sn-Bi alloy (Special improvement additive element: Ag, Cu) |
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